Nanjing Ree-Chip Top Electronic Technology's Integrated Circuit High-Reliability Ceramic Packaging Project (Phase I) was officially commissioned on October 28, 2021.

More than 60 people attended, including Wang Xinchao, Chairman of Xinchao Group, Zhao Haijun, Co-CEO of SMIC, Jia Songliang, Professor at Tsinghua University (video presence), Shen Lei, Deputy Chief Engineer of Fudan Microelectronics, Yang Guoyong, CEO of CORPRO Technology, Huang Feiming, Chairman of Si-Power, Tong Jinzhou, Deputy Director of Pukou District and Director of the Management Committee of Pukou Economic Development Zone, as well as representatives of investors and upstream and downstream companies. The ceremony was themed Setting Sail to the Silicon Sea. Ree-Chip Top CTO Li Zongya hosted the celebration, with Ree-Chip Top CEO Gao Hui delivering a welcome speech and introducing the project.

Ree-Chip Top’s Integrated Circuit High-Reliability Ceramic Packaging Project was established by a team of senior professionals in conjunction with the Pukou Economic Development Zone and the Xinchao Group. The project specializes in high-reliability integrated circuit ceramic packaging with a focus on high-reliability plastic packaging (substrates and frames) and flip-chip SiP to provide one-stop high-reliability packaging process services for GPU, FPGA, DSP, AD/DA, and other products in automotive electronics, medical electronics, aerospace, and other industries.

Gao Hui, CEO of Ree-Chip Top, spoke of the packaging design, thinning, metallization, dicing, mounting, bonding, capping/encapsulation, rib cutting and forming, and other assembly processes in the company's one-stop high-reliability packaging process service. The company's packaging service covers 10 major categories and 300+ varieties, with an annual capacity of 3.5 million ceramic packages, 2 million plastic packages, and 500,000 SiP packages. In the future, the company will focus on ceramic packaging of integrated circuits, accelerate the establishment of high-reliability plastic packaging capabilities, optimize packaging technology and management in search of even more advanced system-level, three-dimensional, and wafer-level packaging, expand into image sensors, microwave, radio frequency, and optical communication to extend service coverage from integrated circuit packaging to special device packaging, and strive to achieve an annual output of 50 million pieces in the nearest possible future.

Xinchao Group Chairman Wang Xinchao congratulated Ree-Chip Top on achieving this major milestone as a shareholder representative. He spoke of how high-reliability packaging would usher in greater development as the emerging markets of new energy vehicles and smart healthcare continued to expand and expressed a hope that Ree-Chip Top and their professional leadership team would contribute to the development of China's integrated circuit industry and high-end packaging.

Tsinghua University Professor Jia Songliang congratulated Ree-Chip Top by video, spoke of the importance of the high-reliability packaging process to the independent development of high-end integrated circuits, and expressed the belief that Ree-Chip Top production would contribute significantly to China’s development of independent and controllable high-end integrated circuits.

Ree-Chip Top’s Integrated Circuit High-Reliability Ceramic Packaging Project reportedly needed only 4 months to move from the start of the project to the production phase, and all while dealing with the COVID-19 pandemic. The success of the project clearly demonstrated the positive and enterprising spirit of the Ree-Chip Top team and the efficient and pragmatic contribution of the Pukou Economic Development Zone to the integrated circuit industry.

The Pukou Economic Development Zone has managed to create a complete integrated circuit industrial chain, attracting more than 250 companies into the Zone, including TSMC, HT-tech, VSOL, Jiangsu Changjing, and Air Products and Chemicals, covering design, manufacturing, packaging and testing, equipment, and materials. Ree-Chip Top’s Integrated Circuit High-Reliability Ceramic Packaging Project has played a significant role in shaping the integrated circuit industry landscape in Pukou District and Nanjing City. It has opened up a distinctive segment of high-reliability integrated circuit packaging in Nanjing, maximized the agglomeration effect for integrated circuit companies, and would benefit the innovative development of the integrated circuit industry in Nanjing and the Yangtze River Delta.