The New Era Youth Forum on Integrated Circuits and the 2021 Chinese Academy of Sciences Institute of Microelectronics Specialization and Dedication Youth Forum were successfully held in Jiangyin City on October 24 in a resounding response to the current need to independently develop and improve the field of integrated circuits in China. The Forum was attended by young microelectronics researchers from leading Chinese and international companies, universities, and research institutions.
The forum received special guidance from the Chinese Academy of Sciences Institute of Microelectronics and the Wuxi Talent Work Leadership Group and was sponsored by the Jiangyin Science, Technology, and Talent Work Leadership Group and the Jiangyin High-tech Industrial Development Zone Management Committee. It was organized by the Jiangyin Municipal Party Committee Organization Department, Jiangyin Municipal Science and Technology Bureau, Jiangyin Science and Technology Association, the Youth Promotion Association, and the Industrialization Promotion Center of the Chinese Academy of Sciences Institute of Microelectronics, Jiangsu Internet of Things Development Research Center, and Jiangyin Integrated Circuit Design Innovation Center Co., Ltd.
The forum was attended by the leadership of the Chinese Academy of Sciences Institute of Microelectronics, Jiangyin City, and the Hi-tech Zone. Young scientists from relevant universities and research institutions, industry and investment institutions, and enterprises were also invited to discuss what could be done to develop and improve the field of integrated circuits in China and encourage young talent to contribute to the process.
Photos of the main forum
Director of the Chinese Academy of Sciences Institute of Microelectronics Industrialization Promotion Center and Jiangyin Integrated Circuit Design Innovation Center Shang Liwei hosting the forum
Chinese Academy of Sciences Institute of Microelectronics Deputy Party Secretary Zhao Zhigang, Jiangyin Municipal People's Government Deputy Mayor Gu Wenyu, and Jiangsu Xinchao Investment Group Co., Ltd. Chairman Wang Xinchao all delivered speeches at the opening ceremony.
Zhao Zhigang spoke of the important decision to deploy the Jiangyin Integrated Circuit Design Innovation Center made by the Chinese Academy of Sciences Institute of Microelectronics and the Jiangyin municipal government to empower Jiangyin's integrated circuit industry. In the past year since its establishment, the Center has enjoyed robust support and guidance from the Chinese Academy of Sciences Institute of Microelectronics, the Hi-tech Zone Management Committee, and the Municipal Science and Technology Bureau, completing the preliminary establishment of the chip design industry service support platform to create an initial integrated circuit design industry cluster in Jiangyin city and promote its coordinated development in Jiangyin. He expressed a hope that young scientists would use it to work together and build consensus on cutting-edge semiconductor research and key technologies and contribute to the development of China's semiconductor industry.
Chinese Academy of Sciences Institute of Microelectronics Deputy Party Secretary Zhao Zhigang delivering a speech
Gu Wenyu spoke of the great significance of the forum to improve technological collaboration and innovation and accelerate the industrial transformation in Jiangyin. As one of the birthplaces of China's township enterprises and the "Southern Jiangsu Model", Jiangyin has always been oriented towards the real economy. According to him, strategical emerging industries like the integrated circuit industry enjoyed a solid industrial base and strong corporate capabilities that would only continue to rise. He asked the relevant authorities, enterprises, and research professionals to capitalize on this opportunity to learn from one another, strengthen communication, and interact more closely to accelerate technological breakthroughs in the industry and make greater contributions to the development of the integrated circuit industry. He expected to see more high-end talent, leading enterprises, and investment funds in Jiangyin for in-depth cooperation and implementation of quality projects.
Jiangyin Municipal People's Government Deputy Mayor Gu Wenyu delivering a speech
Wang Xinchao spoke of the platform that the forum provided for young Chinese microelectronics researchers to strengthen academic exchange and the grand opportunity presented to promote the innovation and development of the integrated circuit industry. Young professionals are the main force driving innovation in the integrated circuit industry, and Wang hoped they would seize the opportunity to respond to international challenges and contribute to the industry in China.
Jiangsu Semiconductor Industry Association Chairman Wang Xinchao delivering a speech
At the agreement signing ceremony, Jiangyin Integrated Circuit Design Innovation Center Deputy Director Yu Lei signed agreements with project representatives for the Jiangyin Xinji Technology Co., Ltd.'s High-Frequency and High-Efficiency Power Management Chip Project, Jiangsu Champhill Microelectronics Co., Ltd.'s 5G RF Front-End Chip Project, Jiangsu Deyi Technology Co., Ltd.'s Brushless Motor Controller R&D Project, Jiangsu Changjin Micro-Electronic Material Co., Ltd.'s Full Range Photoresist R&D and Production for the Localization of Mid-to-High-End Semiconductors Project.
Agreement Signing Ceremony
Wuxi Semiconductor Industry Association Secretary General Huang Anjun, University of Science and Technology of China School of Microelectronics Executive Director Long Shibing, Chinese Academy of Sciences Institute of Microelectronics Associate Researcher Yang Jianguo, National Center for Advanced Packaging Co., Ltd. Marketing Director Zhou Minghao, and New Hope Capital Partner Jiang Yinming delivered keynote speeches entitled "Wuxi's Accountability in Delivering Chip Self-Reliance in China", "Ultra-Wide Bandgap Gallium Oxide Semiconductor Devices", "Exploration of New Architecture Computing Chips Based on a Three-Dimensional Heterogeneous Integrated DRAM Platform", "TSV-Based Advanced Packaging Technology", and "Investment Logic and Trend Analysis of Integrated Circuit Equipment", respectively, speaking in detail about the progress that has been made and the technological and industrial outlook for development trends.