The agreement signing ceremony for Shanghai SinoMCU Microelectronics Co., Ltd.'s settlement in the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base was held at the Xiangyang Conference Center in Huashi Town on the afternoon of September 27. The event was attended by Secretary of the Huashi Town Party Committee Chen Feng, Mayor of Huashi Town Hu Guangyuan, Chairman of Jiangsu Xinchao Technology Group Co., Ltd. Wang Xinchao, Secretary of Xiangyang Village in Huashi Town Li Hua, Director and Deputy General Manager of Shanghai SinoMCU Microelectronics Co., Ltd. Bao Xuhe, Chairman and General Manager of Jiangsu Zunyang Electronic Technology Co., Ltd. Wu Qibin, and key representatives from the Xinchao Group, Jiangsu Xiangyang Group Co., Ltd., Shanghai SinoMCU Microelectronics Co., Ltd., and Zunyang Electronics.

Secretary of the Huashi Town Party Committee Chen Feng predicted that the establishment of the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base in Huashi Town would drive the industrial transformation and upgrading of Huashi Town and inject new momentum into its development. He added that Huashi Town would fully support the construction of the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base and provide the services and guarantees companies entering the base would need to ensure the early completion of the project. He also invited more companies to settle in the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base.

▲Speech by Secretary of the Huashi Town Party Committee Chen Feng

Xinchao Group Chairman Wang Xinchao spoke of his thirty years in the semiconductor packaging and testing industry and a concept he has sought to pioneer in "standardized products, centralized management, domestic equipment and materials, and platform-based operations", with the first domestic platform packaging and testing enterprise, Jiangsu Zunyang Integrated Circuit Packaging and Testing Base, representing an innovative new business model. The new model addresses challenges connected to heavy assets in the integrated circuit packaging and testing industry, simultaneously optimizing the cost structure for customers for greater competitiveness. He wrapped up by expressing his gratitude for the strong support from the Huashi Town government and for the trust of Shanghai SinoMCU Microelectronics Co., Ltd., the first company to settle in the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base. The combined efforts of all parties are expected to lead more enterprises to the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base.

▲Speech by Xinchao Group Chairman Wang Xinchao

Deputy General Manager of Shanghai SinoMCU Microelectronics Co., Ltd. Bao Xuhe spoke of the great honor of being the first enterprise to settle in the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base. According to him, Shanghai SinoMCU Microelectronics Co., Ltd. valued Chairman Wang's new business model and the opportunity to be the first participant. He thanked Huashi Town, the Xinchao Group, and Jiangsu Xiangyang Group Co., Ltd. for resources and the platform and confirmed the company team's intention to see the project put into operation as quickly as possible, to the benefit of all involved.

▲Speech by Deputy General Manager of Shanghai SinoMCU Microelectronics Co., Ltd. Bao Xuhe

Subsequently, Deputy General Manager of Shanghai SinoMCU Microelectronics Co., Ltd. Bao Xuhe and Chairman of Jiangsu Zunyang Electronic Technology Co., Ltd. Wu Qibin signed on behalf of their companies. The successful signing marks a fortuitous beginning for the Jiangsu Zunyang Integrated Circuit Packaging and Testing Base.

▲Signing Ceremony

▲Group Photo