The China IC Packaging & Testing Industry Chain Technology Innovation Strategic Alliance (or National Packaging and Testing Alliance) teamed up with the National Center for Advanced Packaging (or NCAP China) to celebrate industry growth and promote continued exchange and development, holding the "Integrated Circuit Advanced Packaging Industry Chain Collaborative Innovation Development Forum and Sixth Hua Jin Open Day" at the Pullman Wuxi New Lake Hotel on November 22, 2019, timed to coincide with the 10th anniversary of the establishment of the National Packaging and Testing Alliance.
Background
The event, global in perspective and focused on China's industrial development, brought together semiconductor packaging and testing industry leaders, experts, and companies from around the world to discuss the opportunities and challenges of industrial development and explore deeper market cooperation.
Keynote Speech
Alliance Chairman Wang Xinchao delivered a keynote speech titled "Redoubling Efforts to Innovate for Development." Wang noted that while the front-end manufacturing processes no longer benefited from the cost reductions associated with chip node scaling and the increasing market demand for product functionality integration, advanced back-end packaging technologies such as SiP, 2.5D, 3D, PoP, and fanout have continued to evolve. Integrated circuit packaging technology plays an increasingly important role in bringing high-end products to the market, and its value within the packaging body is rising.
This, in turn, has sparked the interest of front-end manufacturers in the advanced packaging field, leading to a gradual encroachment on the packaging market. Major global foundries have aggressively entered the fanout and 2.5D advanced packaging technology markets, intensifying competition in the advanced packaging sector. In this highly competitive industry context, the National Packaging and Testing Alliance must further innovate, take full advantage of the platform's role, and support and assist domestic packaging and testing industry chain enterprises in collaborative development.
Overview
How to effectively leverage the alliance platform, further innovate, and support and assist domestic packaging and testing enterprises in collaborative development in such a competitive industry environment were all front and center during the summit dialogue chaired by Executive Deputy Secretary-General of the Alliance Cao Liqiang, and included discussions on future packaging development trends, advanced packaging processes and technologies, and the relationships between packaging technology, equipment, and materials. Participants included Shennan Circuits Chairman Yang Zhicheng, NAURA Technology Group General Manager Zhao Jinrong, JCET Group CEO Zheng Li, Tongfu Microelectronics CEO Shi Lei, and HT-tech Kunshan General Manager Xiao Zhiyi.
Looking Ahead
The National Packaging and Testing Alliance has done much to enhance China's integrated circuit packaging and testing technology over the past decade, strengthening the collaborative development of the integrated circuit industry chain and building innovative organizations. It has been awarded the National "Class A Alliance" by the Ministry of Science and Technology of China. We wish the alliance even greater success in the next decade.
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